Job Id E1970042
Job Title Packaging Manufacturing Engineer/Fingerprint Module
Post Date 02/28/2019
Company Qualcomm Technologies, Inc.
Job Area Engineering - Hardware
Location China - Shanghai
Job Overview In this job, the engineer will collaborate with functional team to define process, and drive production readiness and ramp-up in supplier site. You also need to drive continuous improvement on yield, address technical problem, work with quality team in enhancing quality control on production line This Job requests frequent travel either domestic or oversea (~50% of time) Accountable for: Drive supplier to setup comprehensive process. Conduct production readiness check and Define production-ramp plans Qualify new Module processes and production lines Monitor production performance to be able to meet all product yield and quality KPI Support requirements for process-change notifications from technical side Support resolution of production issues and customer returns. Monitor supplier metrics and provide input to supplier performance reviews
Minimum Qualifications 5+ years work experience in process engineering of IC module, SMT, cellphone or related field
Excellent verbal and written communication skills, good command of English.
Hands on experience in package/SMT manufacturing and equipment; experience in technical project management. Experience in supplier management is plus
Proficiency in material and package characterization data analysis, and statistical data analysis.
Basic knowledge of quality management tool in manufacturing site.
Able to work independently and coordinate across multi-functional team in addressing technical issue
Self-driven, passionate, and creative.
Preferred Qualifications none
Education Requirements Minimum Bachelor's degree in Mechanical, Semiconductor Packaging,
Materials Engineering or related discipline; advanced degree in Engineering is a plus
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