Job Id E1973590
Job Title Thermal Hardware Engineer
Post Date 06/09/2019
Company Qualcomm Technologies, Inc.
Job Area Engineering - Hardware
Location China - Shanghai
Job Overview The successful candidate will operate as a member of Corporate Engineering Shanghai department design team to conduct system thermal design and analysis for various products such as smart phones, tablets, XRs, entertainment devices etc. Responsibilities include the thermal solution design, mechanical architecture recommendation, data processing, test validation and design optimization by closely working with internal power and thermal HW/SW/test staffs in the fast-paced execution of a variety of multi-disciplined projects. Enthusiasm of engineering and technology. Good at new technology implementation, working with virtual team organization and external vendors for innovative designs, as well as OEMs and manufactures for thermal design trends. Understands project goals and individual contribution toward those goals.
Minimum Qualifications * Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

* 2+ years Hardware Engineering experience or related work experience.
Preferred Qualifications Must be proficient with both thermal simulation and experimental analysis methodologies for semiconductor package and full commercial systems. Good knowledge and background of CFD algorithms/tools, and familiarity with using FloTHERM/Icepak/etc for thermal analysis. Icepak preferred. Require experience with Programming Language/tools such as C, C++, Python as well as Matlab etc tools. Well perform system/board/component level thermal test and power measurement. Strong knowledge with test equipment/methodology including thermocouple, IR camera, data logger, power monitor, power measurement system etc. Understanding on mechanical design of commercial portable devices etc. Be familiar with tear down analysis and implementation of thermal solution/materials including thermal interface materials, heat spreaders, heat pipe, fan system etc. Good trouble-shooting skills and debugging ability on PCB board and system level thermal issues. Self-motivated and quick learner. Outstanding oral and written communication skills, capable of presenting persuasively to all levels of the organization in an articulate and succinct manner. Minimum 4yrs thermal design and testing working experience. Bachelors degree in Thermal engineering, Mechanical engineering or equivalent degree.
Education Requirements Required: Bachelor's, Electrical Engineering or equivalent experience
Preferred: Master's, Electrical Engineering or equivalent experience
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