Job Id E1975126
Job Title BSP Test Engineer
Post Date 07/29/2019
Company Qualcomm Technologies, Inc.
Job Area Engineering - Test
Location China - Shanghai
Job Overview Designs test plans, scenarios, scripts, or procedures on mobile phone/IoT product based on Qualcomm chipset Design & execute manual/automatic test cases for CBSP/power/performance/thermal testing Triage CBSP/power/performance/thermal issues and work close with developer to fix/verify issues Define CBSP/power/performance/thermal test plan for project
Minimum Qualifications * Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

* 1+ years experience with Programming Language such as C, C++, Java, Python, etc.
Preferred Qualifications 3+ years CBSP Systems Test Engineering or related work experience required: -Android CBSP test areas experience- kernel, RIL/TEL, UX performance, power, thermal -Test automation using Perl, Python in any of these areas like power & thermal testing, BSP/security/peripherals, kernel -Solid experience in benchmark test in CPU/GPU/DDR/IO etc -Solid experience in Android performance/performance test and performance trace log analysis Skills -Solid knowledge of the embedded processor architecture and System-On-Chip infrastructure. -Basic knowledge of bootloader, Linux kernel and Android platform. -Solid skill of BSP or kernel level test case design and implementation especially concurrency / stress test cases. -Basic skill of BSP or kernel issue triage & debugging. -Strong programming skills: proficient in one of the programming languages like C, Python, Java, shell etc; -Strong knowledge in Linux kernel; - Basic knowledge to analyze the power waveform such as identifying wake up reasons.
Education Requirements Required: Bachelor's, Computer Engineering or equivalent experience
Preferred: Master's, Computer Engineering or equivalent experience
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