Job Id E1976046
Job Title Staff Packaging Engineer
Post Date 09/17/2019
Company Qualcomm Technologies, Inc.
Job Area Engineering - Manufacturing/Quality/Other
Location China - Shenzhen
Job Overview Member of IC Package Engineering team directly supporting customers with packaging related quality issues, product development, and new applications with specific emphasis on RF Front End products Examples of customer support areas: Board level reliability (BLR) qualification SMT (Surface Mount Technology) Packaging SMT/BLR issue triage and root cause isolation Production launch into high volume manufacturing (HVM) Design for Manufacturability (DFM) reviews Technology roadmap alignment and spec compliance reviews Publication of application notes and process recommendations Approximately 20% domestic China travel and almost daily direct customer interaction Examples of advanced package technologies supported: Land Grid Array Package (LGA) Ball Grid Array (BGA) and Chip Scale Packages (CSP) Wafer level packaging (WLP) Fan out wafer level packaging (foWLP) Package on Package (PoP) Other Duties as needed: Collaboration with internal teams (Design, NPI, Modeling, Quality, etc) to give regular progress updates. Project/case management; statistical analysis including DOE methods Interface with external suppliers and equipment vendors to understand latest technologies. Industry benchmarking and competitive analysis
Minimum Qualifications Required to be fluent in Mandarin with functional proficiency in English
Permitted to work in Mainland China with ability to travel to US at least once per year
Minimum of six years of experience in SMT/BLR and package technology development
Must have strong written and oral communication

Working knowledge of:
Package assembly processes
Surface mount technology (SMT)
Reliability testing and failure modes
Failure analysis (FA)
PCB fabrication
Underfill (UF) and rework
High temperature warpage analysis
Design for reliability
Industry packaging trends and customer considerations
Packaging materials analysis
Mechanical failure analysis techniques
JEDEC, IPC and other industry specifications
Preferred Qualifications Ability to travel to Vietnam and/or India preferred but not required Independent decision maker and problem solver with little oversight needed Previous experience with portable consumer products and direct manufacturing experience with package assembly or SMT strongly preferred.
Education Requirements Required: Bachelor's, Materials Science or Mechanical Engineering or equivalent
Preferred: Master's, Materials Science or Mechanical Engineering or equivalent
Email your CV to xiaodeng@qti.qualcomm.com
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